3x More Efficient Than Industry Standard
69% of Submitted Candidates Get an Offer
Every number below comes from our own placement data, shown against independently sourced industry averages for engineering hiring. Judge the gap yourself.
Lead Stat
Interviews per Offer: 1.46 to 11
Industry average: 4.8 : 1 · well-calibrated processes: 2:1–3:1
~69% of the engineers we put in front of a hiring manager walk out with an offer. That's not luck - it's a 4-criteria qualification standard (technical depth, domain match, culture fit, schedule alignment) applied before you ever see a resume. Your engineering leads interview less and build more.
All-time ratio: 2 : 1 - and improving.
Interviews per Offer
Lower is better. Fewer interviews per hire means your engineering leads interview less and build more.
Quality Benchmarks
Beyond Speed: The Rest of the Placement Picture
Median Fill Time
Principal-level chip, board, and embedded engineers
31 days2
Engineering roles average 58 days; niche disciplines run past 100.
When you're six weeks from tape-out, that gap is the project.
Offer Acceptance
Of candidates we submit
97%+1
Hiring-process average is ~69%; healthy in-house range is 85–95%.
A real shortlist gets accepted. 2–3 engineers who fit the work - not 10 resumes to wade through.
Contract Extensions
Kept past the original SOW
43%+
No industry benchmark exists - most firms don't track it.
Average engagement runs ~9 months. Engineers who contribute on Day 1 don't get released on Day 90.
And, at Scale
140+
Engineering teams served - most come back.
950+
Placements - exclusively semiconductor, embedded & hardware.
50,000+
Engineers we actually know.
Where These Numbers Come From
Methodology & Sources
Game 7 figures are calculated from our internal placement records, 2025–26, across contract and contract-to-hire engagements in semiconductor, embedded, and hardware engineering.
We use medians where noted because averages hide outliers - in both directions.
- 1.NACE - National Association of Colleges and Employers recruiting benchmarks (interview-to-offer, offer acceptance).
- 2.Workable / DHI engineering time-to-fill data (Workable benchmarks + DHI labor market data for engineering roles).
- 3.SmartRecruiters 2025 Benchmark Report (cross-industry hiring process metrics).
FAQ
Common Questions
What is a good interview-to-offer ratio for engineering hiring?
The industry average is roughly 4.8 interviews per offer; a well-calibrated process runs 2:1 to 3:1. Game 7's 2025–26 ratio is 1.46:1 - about 69% of engineers we submit to interview receive an offer - because candidates are qualified against technical depth, domain match, culture fit, and schedule alignment before a hiring manager ever sees them.
How long does it take to fill a principal-level semiconductor engineering role?
Engineering roles average about 58 days to fill, and niche disciplines like DFT, verification, or analog/mixed-signal design can run past 100 days. Game 7's median fill time for principal-level chip, board, and embedded engineers is 31 days.
How does Game 7 measure placement quality, not just speed?
Three signals: 97%+ of our offers are accepted, 43%+ of our contract engineers are extended beyond the original SOW, and the average engagement runs about 9 months. Engineers who contribute on Day 1 don't get released on Day 90.
Where do the industry benchmarks on this page come from?
Benchmarks are drawn from NACE recruiting benchmarks, Workable/DHI engineering time-to-fill data, and the SmartRecruiters 2025 Benchmark Report. Game 7 figures come from our internal placement data, 2025–26.
Run One Req with Us
See How We'd Run Your Next Req
Tell us the discipline, the schedule phase, and the gap. We'll tell you exactly who we'd submit and how fast.