From Our Own Placement Data
Two in Three Interviewed Engineers Get an Offer
Every number below comes from our own placement records. Most firms don't publish these metrics. We'd rather you hold us to them.
Lead Stat
Two in Three. Interview to Offer.
Count your last five hires and the interviews behind each one.
Two in three of the engineers we put in front of a hiring manager walk out with an offer. That's not luck - it's a 4-criteria qualification standard (technical depth, domain match, culture fit, schedule alignment) applied before you ever see a resume. Your engineering leads interview less and build more.
Measured across placements from January 2025 to the present.
Interview-to-Offer Rate
More of the engineers you interview convert to offers, so your engineering leads interview less and build more.
Where We Place
900+ Engineers Placed, Mid Through Principal Level
Every dot is a city where a Game 7 contract engineer has delivered. From the obvious hubs to the fabs, labs, and program sites in between.
Quality Signals
Beyond Speed: The Rest of the Placement Picture
Median Time to Offer
Principal-level chip, board, and embedded engineers
19 days
Under 24 hours to first submission; roughly 26-day median from submission to placement.
When you're six weeks from tape-out, that speed is the project.
Offer Acceptance
Of candidates we submit
97%+
Measured across all offers extended, 2025–26.
A real shortlist gets accepted. 2–3 engineers who fit the work - not 10 resumes to wade through.
Contract Extensions
Roughly 77 extensions per 100 placements
77 per 100
Extensions are counted per event - one engineer extended twice counts twice - so this is not 77% of placements.
10-month average engagement. Engineers who contribute on Day 1 don't get released on Day 90.
And, at Scale
140+
Engineering teams served - most come back.
900+
Placements - exclusively semiconductor, embedded & hardware.
50,000+
Engineers we actually know.
Where These Numbers Come From
How We Measure
Every figure on this page is calculated from our internal placement records, 2025–26, across contract and contract-to-hire engagements in semiconductor, embedded, and hardware engineering.
We use medians where noted because averages hide outliers - in both directions.
These are our own funnel numbers. For the wider market - openings per req, engagement length, and where the bill-rate premium actually sits - read the Q3 2026 Engineered Workforce report.
FAQ
Common Questions
What is Game 7's interview-to-offer ratio?
Two in three engineers we put in front of a hiring manager get an offer. Candidates are qualified against technical depth, domain match, culture fit, and schedule alignment before a hiring manager ever sees them, so the interviews you run convert instead of piling up.
How long does it take to fill a principal-level semiconductor engineering role?
Game 7's 2025 funnel: under 24 hours to first submission, a 19-day median to offer, and a roughly 26-day median from submission to placement for principal-level chip, board, and embedded engineers.
How does Game 7 measure placement quality, not just speed?
Three signals: 97%+ of our offers are accepted, we see roughly 77 contract extensions per 100 placements (extensions counted per event, so one engineer extended twice counts twice), and the average engagement runs about 10 months. Engineers who contribute on Day 1 don't get released on Day 90.
Where do the numbers on this page come from?
Every figure is calculated from Game 7's internal placement records, 2025–26, across contract and contract-to-hire engagements in semiconductor, embedded, and hardware engineering. We use medians where noted because averages hide outliers.
Run One Req with Us
See How We'd Run Your Next Req
Tell us the discipline, the schedule phase, and the gap. We'll tell you exactly who we'd submit and how fast.