Section
About the Role
Headcount: 1
Contract: 6 months; Start: Late October or first week of November 2026
Why Hiring
- Backfill for an employee planning retirement in January or March 2027, seeking overlap for training.
End Product
- Supporting a different product than previous projects with the same team.
Tech / Domain Environment
- PCB layout engineering
Job Duties
- Perform PCB layout engineering tasks.
- Collaborate with team members to ensure design requirements are met.
Must Haves
- Minimum 7+ years of experience (10+ ideal) in layout engineering
- Minimum 3 to 4 core skills required from the engineering stack
Nice to Haves
- Additional years of experience beyond the minimum
The ideal candidate should have strong relevant and recent technical and hands-on background and be able is hit the ground running as an individual contributor
- Contribute to, or lead, PCB and package substrate layout development for leading-edge Optical communication products
- Ensure compliance with IPC standards, company design practices, and fabrication capabilities.
- Collaborate with electrical, mechanical, thermal, signal-integrity, power-integrity, and manufacturing teams.
- Work with PCB fabricators, and substrate vendors to close DFMs. Minimum Requirements
- Bachelor’s degree or equivalent certifications with a minimum of 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering.
- Expert-level proficiency with Cadence Allegro PCB design tools
- Strong demonstrated working experience of complex high-density, high-speed PCB and substrate designs using advanced HDI, stacked micro-via, sequential lamination, and fine-pitch BGA technologies.
- Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages.
- Working understanding of transmission line layout geometries and rules (microstrip, strip line, CPW, etc.)
- Demonstrated experience in layout of compact low voltage and high current multiphase DC-DC power converters for state-of-the-art processors and GPUs
- Strong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances.
- Demonstrated success delivering high-volume, high-reliability communication products under aggressive schedules. Highly Desired Skills
- Demonstrated experience with mSAP PCB layout design
- Demonstrated experience with layout design of state of art optical pluggable products (CFP2, QSFP-DD, OSFP)
- Proficiency in Cadence SiP tools and Substrate layout techniques
- Proficiency in layout of designs with Wire Bond components
- Strong understanding of PCB fabrication and assembly processes
- Strong knowledge of relevant industry standards (IPC Class 2/3, JEDEC, etc.)