Location: Fremont, CA onsite 0% travel
Contract: 1 year;
Start: ASAP
Interview Process: 1st round virtual (1 hour), 2nd round on-site (3 hours);
Why Hiring:
- Support design validation and optimization in Etch Engineering
- Contribute to technology packaging through simulation and testing
End Product: Design validation and optimization for semiconductor packaging
Tech/Domain Environment:
- Ansys Fluent, Ansys Mechanical, NX
- Windows OS
- CFD, FEA, fluid mechanics, heat transfer
- MS Office
Job Duties:
- Perform CFD and FEA simulations for design validation
- Conduct structural analysis for semiconductor packaging
- Optimize designs based on simulation data
- Collect and analyze testing data for performance metrics
- Collaborate with engineering teams on design improvements
- Document simulation results and design recommendations
Must Haves:
- **8+ years** in mechanical engineering
- Ansys Fluent or equivalent in production with 95% simulation accuracy
- NX or equivalent CAD in production with 100+ designs completed
- Experience in fluid mechanics and heat transfer with documented results
- Proven experience in semiconductor industry with 5+ projects
- On-site presence required 5 days per week
Nice to Haves:
- Experience in additive manufacturing simulation (AM)
- Knowledge of structural analysis techniques with 10+ simulations
- Familiarity with MS Office for documentation and reporting
Operational / Non-Technical Requirements:
- On-site work required 5 days per week
- No remote work options available
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